Selective shielding of radio frequency modules

ABSTRACT

Aspects of this disclosure relate to selectively shielded radio frequency modules. A radio frequency module can include a package substrate, a radio frequency shielding structure extending above the package substrate, a radio frequency component over the package substrate and in an interior of the radio frequency shielding structure, and an antenna on the package substrate external to the radio frequency shielding structure. The shielding structure can include a shielding layer providing a shield over the radio frequency component and leaving the radio frequency module unshielded over the antenna.

CROSS REFERENCE TO PRIORITY APPLICATIONS

This application claims the benefit of priority under 35 U.S.C. § 119(e)of U.S. Provisional Patent Application No. 62/324,768, filed Apr. 19,2016 and titled “SELECTIVE SHIELDING OF RADIO FREQUENCY MODULES,” thedisclosure of which is hereby incorporated by reference in its entiretyherein. This application claims the benefit of priority under 35 U.S.C.§ 119(e) of U.S. Provisional Patent Application No. 62/324,750, filedApr. 19, 2016 and titled “METHODS FOR SELECTIVELY SHIELDING RADIOFREQUENCY MODULES,” the disclosure of which is hereby incorporated byreference in its entirety herein.

BACKGROUND Technical Field

This disclosure relates to selective shielding of a radio frequencymodule.

Description of Related Technology

Packaged semiconductor modules can include integrated shieldingtechnology within a package. A shielding structure can be formed arounda radio frequency component. The shielding structure can shield theradio frequency component from electromagnetic radiation that isexternal to the shielding structure. The shielding structure can shieldcircuit elements external to the shielding structure fromelectromagnetic radiation emitted by the radio frequency component. Asmore components are being integrated together with each other in a radiofrequency module, shielding components from each other in a compact andefficient manner can be challenging.

SUMMARY OF CERTAIN INVENTIVE ASPECTS

The innovations described in the claims each have several aspects, nosingle one of which is solely responsible for its desirable attributes.Without limiting the scope of the claims, some prominent features ofthis disclosure will now be briefly described.

One aspect of this disclosure is a packaged radio frequency module. Thepackaged radio frequency module includes a package substrate, a radiofrequency shielding structure extending above the package substrate, aradio frequency component over the package substrate and in an interiorof the radio frequency shielding structure, and an antenna on thepackage substrate external to the radio frequency shielding structure.

The radio frequency shielding structure can include a shielding layerproviding a shield over the radio frequency component and leaving thepackaged radio frequency module unshielded over the antenna. The radiofrequency shielding structure can include wire bonds in contact with theshielding layer.

The radio frequency shielding structure can include wire bonds disposedbetween the antenna and the radio frequency component. The wire bondscan be configured to provide radio frequency shielding between theantenna and the radio frequency component. The radio frequency shieldingstructure can include wire bond walls disposed around at least two sidesof the radio frequency component. The radio frequency shieldingstructure can include wire bond walls disposed around at least threesides of the radio frequency component. The radio frequency shieldingstructure can include wire bond walls surrounding the radio frequencycomponent.

The radio frequency shielding structure can include a wire bond walldisposed around a first side of the radio frequency component and aconformal structure disposed around a second side of the radio frequencycomponent, in which the second side opposes the first side. The radiofrequency shielding structure can include a wire bond wall disposedaround a side of the radio frequency component and a conformal structuredisposed around another side of the radio frequency component.

The radio frequency shielding structure can include conformal wallssurrounding the radio frequency component.

The radio frequency shielding structure can include a shielding layersubstantially parallel to the package substrate. The radio frequencycomponent can be disposed between the shielding layer and the packagesubstrate. The shielding layer can include copper. The packaged radiofrequency module can further include a protective layer over theshielding layer such that the shielding layer is disposed between theprotective layer and the radio frequency component. The protective layercan include titanium.

The packaged radio frequency module can include features resulting fromremoving a mask over the antenna after forming the shielding layer.

The packaged radio frequency module includes features resulting fromlaser removal of material of the shielding layer over the antenna afterforming the shielding layer.

A molding material can be disposed over the antenna. The antenna can bedisposed along at least two sides of a perimeter of the radio frequencycomponent.

The radio frequency component can include a radio frequency front endintegrated circuit. The radio frequency component can further include acrystal. The radio frequency front end integrated circuit can include asilicon-on-insulator die.

The radio frequency component can include a low noise amplifier. Theradio frequency component can include a multi-throw radio frequencyswitch. The radio frequency component can include a power amplifier.

The radio frequency component can be attached to the package substrateand the antenna can be printed on the package substrate. The packagesubstrate can be a laminate substrate. In certain embodiments, theantenna can include a first portion on a first side of the packagesubstrate and a second portion on a second side of the packagesubstrate, in which the first side opposing the second side. Accordingto some embodiments, the antenna can include a trace on the packagesubstrate and a patterned conductive material over a molding material,in which the trace connected to the patterned conductive material by awire bond.

Another aspect of this disclosure is a packaged radio frequency modulethat includes a package substrate, a radio frequency component on thepackage substrate, an antenna on the package substrate, and a shieldinglayer providing a shield over the radio frequency component and leavingthe packaged radio frequency module unshielded over the antenna.

The packaged radio frequency module can further include one or morefeatures of any of the radio frequency modules discussed herein.

Another aspect of this disclosure is a system board assembly thatincludes a packaged component and a system board on which the packagedcomponent is disposed. The packaged component includes a radio frequencycomponent on a package substrate, a radio frequency shielding structurearound the radio frequency component, and an antenna on the packagesubstrate and outside of the radio frequency shielding structure. Thesystem board includes ground pads electrically connected to the radiofrequency shielding structure of the packaged component.

The system board assembly can further include comprising an electroniccomponent on the system board, and the shielding structure can provideradio frequency isolation between the radio frequency component and theelectronic component.

The packaged component can include includes one or more features of themodules discussed herein.

Another aspect of this disclosure is a front end module that includes: aradio frequency (RF) component on a package substrate, the RF componentincluding a low noise amplifier and a switch configured to selectivelyelectrically connect the low noise amplifier with the antenna; an RFshielding structure disposed around the RF component; and an antenna onthe package substrate, the antenna being external to the RF shieldingstructure.

The front end module can further include a bypass path, and the switchcan be configured to electrically connect the low noise amplifier andthe integrated antenna in a first state and to electrically connect thebypass path and the integrated antenna in a second state.

The front end module can further include a power amplifier, the switchand the switch can be configured to electrically connect the poweramplifier and the integrated antenna in a third state. The low noiseamplifier and the power amplifier circuit can be embodied on a singledie. The die can be a semiconductor-on-insulator die.

The front end module can further include one or more features of any ofthe radio frequency modules discussed herein.

Another aspect of this disclosure is wireless communication device thatincludes: a packaged component including a radio frequency (RF)component on a package substrate, an RF shielding structure around theRF component, and an antenna on the package substrate and outside of theRF shielding structure; a transceiver in communication with the RFcomponent; and a processor in communication with the transceiver.

The packaged component can further include one or more features of theRF modules discussed herein. The RF component can further include one ormore features of the front end integrated circuits discussed herein.

Another aspect of this disclosure is packaged radio frequency (RF)module that includes a package substrate; an RF shielding structure; anRF component on the package substrate and in an interior of the RFshielding structure; and an electronic component on the packagesubstrate external to the RF shielding structure, the electroniccomponent being unshielded on a side opposite the package substrate.

The packaged radio frequency module can further include one or morefeatures discussed herein.

Another aspect of this disclosure is an integrated circuit assembly thatincludes a carrier including a major surface and a printed antenna onthe major surface; and a packaged component on the major surface of thecarrier and disposed laterally from the printed antenna, the packagedcomponent including a radio frequency component that is surrounded by ashielding structure.

The shielding structure can include a conformal shield around thepackaged component.

The shielding structure can further include a ground pad on the carrier.

The radio frequency circuit can include at least one of a poweramplifier, a low noise amplifier, or a radio frequency switch.

Another aspect of this disclosure is a method of manufacturing a radiofrequency (RF) module. The method includes providing an RF moduleincluding an RF component and an antenna, and forming a shielding layerover a portion of the RF module such that (i) the RF component isshielded by the shielding layer and the antenna is unshielded by theshielding layer and (ii) the shielding layer is in contact with one ormore conductive features arranged to provide shielding between the radiofrequency component and the antenna.

The method can further include masking a portion of the RF module overthe antenna with a mask prior to forming the shielding layer. Formingthe shielding layer can include removing the mask over the antenna.Masking the portion of the RF module can include masking the RF modulewith a mask and laser cutting a selected area of the mask.

Forming the shielding layer can include laser removal of conductivematerial over the antenna.

Forming the shielding layer can include sputtering a conductive materialand the shielding layer includes the conductive material. The conductivematerial can include copper. The method can further include forming aprotective layer over the shielding layer such that the shielding layeris disposed between the protective layer and the RF component. Theprotective layer can include titanium.

The method can further include singulating the RF module prior toforming the shielding layer. Alternatively, the method can includesingulating the RF module after to forming the shielding layer.

Forming the shielding layer can include forming the shielding layer suchthat the shielding layer is in contact with wire bonds disposed along atleast one side of the RF component.

The RF module can include a package substrate on which the RF componentand the antenna are disposed. The shielding layer can be formedsubstantially parallel to the package substrate, and the RF componentcan be disposed between the shielding layer and the package substrateafter the shielding layer is formed.

The RF module can include a shielding structure that includes theshielding layer, in which the RF component is in an interior of theshielding structure and the antenna is external to the shieldingstructure. The shielding structure can include conductive features thatextend over the packaging substrate to the shielding layer. Theconductive features can include wire bonds. The conductive features caninclude wire bonds and a conformal layer. The shielding structure caninclude a plurality of wire bonds disposed between the antenna and theRF component and configured to provide RF shielding between the antennaand the RF component.

The shielding structure can include a wire bond wall disposed around aside of the RF component and a conformal structure disposed aroundanother side of the RF component. The shielding structure can include awire bond wall disposed around a side of the RF component and aconformal structure disposed around an opposing side of the RFcomponent. The e shielding structure can include wire bond wallsdisposed around at least two sides of the RF component. The e shieldingstructure can include wire bond walls disposed around at least threesides of the RF component. The shielding structure can include wire bondwalls surrounding the RF component. The shielding structure can includea plurality of wire bonds disposed between the antenna and the RFcomponent and configured to provide RF shielding between the antenna andthe RF component.

A molding material can be disposed over the antenna prior to forming theshielding layer. The antenna can be disposed along at least two sides ofa perimeter of the RF component.

The RF component can include an RF front end integrated circuit. The RFcomponent can include a crystal. The RF front end integrated circuit caninclude a silicon-on-insulator die.

The RF component can include a low noise amplifier. The RF component caninclude a multi-throw RF switch. The RF component can include a poweramplifier. The package substrate can be a laminate substrate.

Another aspect of this disclosure is a method of manufacturing a radiofrequency (RF) module. The method includes providing an RF moduleincluding an RF component and an antenna, masking a portion of the RFmodule over the antenna with a mask, forming a conductive layer over theRF module, and removing the mask such that a shielding layer is over theRF component and the antenna is unshielded by the shielding layer, theshielding layer including conductive material of the conductive layer.

Masking the portion of the RF module can include masking the RF modulewith a mask and laser cutting a selected area of the mask.

The shielding layer can be in contact with wire bonds disposed betweenthe radio frequency component and the antenna after removing the mask.

Another aspect of this disclosure is a method of manufacturing a radiofrequency (RF) module. The method includes providing an RF moduleincluding an RF component and an antenna, forming a conductive layerover the RF module, and removing conductive material of the conductivelayer over the antenna such that a shielding layer is over the RFcomponent and the antenna is unshielded by the shielding layer.

Removing the conductive material can include using a laser to remove theconductive material over the antenna.

The shielding layer can be in contact with wire bonds disposed betweenthe radio frequency component and the antenna after removing theconductive material.

Another aspect of this disclosure is a radio frequency modulemanufactured by any of the methods discussed herein.

Another aspect of this disclosure is a packaged radio frequency modulethat includes a package substrate, a radio frequency component on thepackage substrate, a multi-layer antenna, and a radio frequencyshielding structure configured to provide shielding between themulti-layer antenna and the radio frequency component.

The multi-layer antenna can include a first portion on a first side ofthe package substrate and a second portion on a second side of thepackage substrate, the first side opposing the second side. Themulti-layer antenna can include a first conductive trace on a first sideof the package substrate and a second conductive trace on a second sideof the package substrate, in which the first side opposes the secondside. The packaged radio frequency module can include a via in thepackage substrate. The first conductive trace can be connected to thesecond conductive trace by way of the via. The packaged radio frequencymodule can further include a pad on the second conductive trace, inwhich the pad is configured for connecting to a system board.

The multi-layer antenna can be implemented in two different layers onthe same side of the package substrate. The multi-layer antenna caninclude a trace on the package substrate and a patterned conductivematerial over a molding material. The trace can be electricallyconnected to the patterned conductive material by a wire bond. The radiofrequency shielding structure can include a shielding layer over theradio frequency component, in which the shielding layer being spacedapart from the package substrate by substantially the same distance asthe patterned conductive material of the multi-layer antenna.

The packaged radio frequency module can further include a matchingcircuit coupled to the multi-layer antenna. The matching circuit caninclude a passive impedance element that is external to the radiofrequency shielding structure.

The multi-layer antenna can be a folded monopole antenna.

The radio frequency component can include a front end integratedcircuit, a crystal, and a system on a chip.

The radio frequency shielding structure can include a wire bond disposedbetween the multi-layer antenna and the radio frequency component.

The radio frequency shielding structure can include a conductiveconformal structure disposed between the multi-layer antenna and theradio frequency component. The packaged radio frequency module canfurther include a through mold via having a sloped sidewall and theconductive conformal structure can be over the sloped sidewall.

Another aspect of this disclosure is a system board assembly thatincludes a packaged component and a system board. The packaged componentincludes a radio frequency component on a package substrate, amulti-layer antenna, and a radio frequency shielding structure aroundthe radio frequency component and configured to provide shieldingbetween the radio frequency component and the multi-layer antenna. Thepackaged component is disposed on the system board. The system boardincludes ground pads electrically connected to the radio frequencyshielding structure.

The multi-layer antenna can include a first trace on a first side of thepackage substrate and a second trace on a second side of the packagesubstrate, in which the first side opposes the second side. A pad on thesecond trace can be soldered to another pad on the system board.

Another aspect of this disclosure is a wireless communication devicethat includes a packaged radio frequency module and a transceiver. Thepackaged radio frequency module includes a radio frequency component ona package substrate, multi-layer antenna, and a radio frequencyshielding structure that includes a conductive feature disposed betweenthe radio frequency component and the multi-layer antenna. Thetransceiver is in communication with the radio frequency component.

The radio frequency component can be configured to provide a wirelesspersonal area network signal and/or a wireless local area network signalto the multi-layer antenna.

For purposes of summarizing the disclosure, certain aspects, advantagesand novel features of the innovations have been described herein. It isto be understood that not necessarily all such advantages may beachieved in accordance with any particular embodiment. Thus, theinnovations may be embodied or carried out in a manner that achieves oroptimizes one advantage or group of advantages as taught herein withoutnecessarily achieving other advantages as may be taught or suggestedherein.

The present disclosure relates to U.S. patent application Ser. No.15/490,349, titled “METHODS FOR SELECTIVELY SHIELDING RADIO FREQUENCYMODULES,” filed on even date herewith, the entire disclosure of which ishereby incorporated by reference herein. The present disclosure relatesto U.S. patent application Ser. No. 15/490,436, titled “SELECTIVELYSHIELDING RADIO FREQUENCY MODULE WITH MULTI-LAYER ANTENNA,” filed oneven date herewith, the entire disclosure of which is herebyincorporated by reference herein.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of this disclosure will now be described, by way ofnon-limiting example, with reference to the accompanying drawings.

FIG. 1 is a schematic diagram of an example radio frequency module thatincludes a radio frequency component and an integrated antenna accordingto an embodiment.

FIG. 2 is a cross sectional view of the radio frequency module of FIG. 1prior to forming a shielding layer over the radio frequency componentaccording to an embodiment.

FIG. 3 is a cross sectional view of the radio frequency module of FIG. 1with a shielding layer over the radio frequency component and not overthe antenna according to an embodiment.

FIG. 4A is a flow diagram of an illustrative process that includesforming a shielding layer over a radio frequency component of a moduleand leaving an antenna unshielded according to an embodiment.

FIGS. 4B, 4C, 4D, and 4E illustrate an example module or strip ofmodules corresponding to various stages of the process of FIG. 4Aaccording to an embodiment.

FIG. 5A is a flow diagram of another illustrative process that includesforming a shielding layer over a radio frequency component of a moduleand leaving an antenna unshielded according to an embodiment.

FIGS. 5B, 5C, 5D, 5E, and 5F illustrate an example module or strip ofmodules corresponding to various stages of the process of FIG. 5Aaccording to an embodiment.

FIG. 6A is a flow diagram of another illustrative process that includesforming a shielding layer over a radio frequency component of a moduleand leaving an antenna unshielded according to an embodiment.

FIGS. 6B, 6C, 6D, 6E, and 6F illustrate an example module, strip ofmodules, or group of modules corresponding to various stages of theprocess of FIG. 6A according to an embodiment.

FIG. 7A is a flow diagram of another illustrative process that includesforming a shielding layer over a radio frequency component of a moduleand leaving an antenna unshielded according to an embodiment.

FIGS. 7B, 7C, 7D, 7E, and 7F illustrate an example module or group ofmodules corresponding to various stages of the process of FIG. 7Aaccording to an embodiment.

FIG. 8A is a flow diagram of another illustrative process that includesforming a shielding layer over a radio frequency component of a moduleand leaving an antenna unshielded according to an embodiment.

FIGS. 8B, 8C, 8D, 8E, 8F, 8G, 8H, and 8I illustrate an example module,strip of modules, or group of modules corresponding to various stages ofthe process of FIG. 8A according to an embodiment.

FIG. 9A is a schematic diagram of an example of a radio frequency moduleaccording to an embodiment.

FIG. 9B is a schematic diagram of an example of a radio frequency moduleaccording to an embodiment. FIG. 9C is another view of the radiofrequency module of FIG. 9B after a shielding layer and a conformalstructure are formed.

FIG. 9D is a schematic diagram of an example of a selectively shieldedradio frequency module according to an embodiment.

FIG. 9E is a schematic diagram of an example of a selectively shieldedradio frequency module according to an embodiment.

FIG. 9F is a schematic diagram of an example of a selectively shieldedradio frequency module according to an embodiment.

FIG. 9G illustrates an example of a shielded radio frequency module withan ablation pattern leaving a portion of the radio frequency moduleunshielded according to an embodiment.

FIG. 9H illustrates an example of a selectively shielded radio frequencymodule according to an embodiment.

FIG. 9I illustrates an example of a selectively shielded radio frequencymodule with an unshielded portion between two shielded portionsaccording to an embodiment.

FIG. 9J illustrates an example of a selectively shielded radio frequencymodule with an unshielded portion between shielded portions according toan embodiment.

FIGS. 10A and 10B illustrate a radio frequency module that includes anintegrated antenna implemented on opposing sides of a package substrateaccording to an embodiment. FIG. 10 is a top view of the radio frequencymodule. FIG. 10B is a bottom view of the radio frequency module.

FIG. 11A illustrates a radio frequency module that includes anintegrated antenna partially implemented over molding material accordingto an embodiment. FIG. 11B illustrates another view of the radiofrequency module of FIG. 11A.

FIG. 12 illustrates an RF module with an integrated antenna shieldedfrom an RF component according to an embodiment.

FIG. 13A illustrates an RF module with a through mold via according toan embodiment. FIG. 13B illustrates an RF module after the conductivelayer shown in FIG. 13A is removed over an antenna according to anembodiment.

FIG. 14A is a top view of a shielded RF component on a carrier with aprinted antenna according to an embodiment. FIG. 14B is a side view ofthe shielded RF component on the carrier with the printed antenna.

FIG. 15A is a schematic block diagram of front end system according toan embodiment.

FIG. 15B is a schematic block diagram of front end system according toanother embodiment.

FIG. 15C is a schematic block diagram of front end system according toanother embodiment.

FIG. 16A is a schematic block diagram of an illustrative wirelesscommunication device that includes a module with an integrated antennain accordance with one or more embodiments.

FIG. 16B is a schematic block diagram of another illustrative wirelesscommunication device that includes a module with an integrated antennain accordance with one or more embodiments.

DETAILED DESCRIPTION OF CERTAIN EMBODIMENTS

The following detailed description of certain embodiments presentsvarious descriptions of specific embodiments. However, the innovationsdescribed herein can be embodied in a multitude of different ways, forexample, as defined and covered by the claims. In this description,reference is made to the drawings where like reference numerals canindicate identical or functionally similar elements. It will beunderstood that elements illustrated in the figures are not necessarilydrawn to scale. Moreover, it will be understood that certain embodimentscan include more elements than illustrated in a drawing and/or a subsetof the elements illustrated in a drawing. Further, some embodiments canincorporate any suitable combination of features from two or moredrawings.

Certain radio frequency (RF) modules can include a shielding structureto provide shielding for electromagnetic interference. Such shieldingstructures can shield an entire module and/or all circuitry of a module.In some instances, shielding may only be desired over a portion of amodule. For instance, in a module with an RF circuit and an integratedantenna, it can be desirable to provide a shield around the RF circuitand leave the antenna unshielded. This can provide RF isolation for theRF circuit and also allow the antenna to receive and/or transmit signalswithout the shielding structure interfering. Accordingly, products withselective shielding can be desirable. Moreover, methods to form a shieldover a selected portion of a module that are accurate and repeatable canbe desirable for high volume manufacturing.

Aspects of this disclosure relate to methods of partially shielding aradio frequency module. Such methods can include forming a shieldinglayer over a shielded portion of the radio frequency module and leavingan unshielded portion of the radio frequency module unshielded. Theshielding layer can shield a radio frequency circuit of the radiofrequency module and leave an antenna of the radio frequency moduleunshielded. The shielding layer can be formed by way of an additiveprocess or a subtractive process. For instance, the shielding layer canbe formed by masking a portion of the radio frequency module with amask, forming a shielding layer, and removing the mask so as to leavethe area that was previously masked unshielded. As another example, theshielding layer can be formed by forming a conductive layer over themodule and removing the conductive layer over a portion of the radiofrequency module. A laser can be used to remove the conductive layerover the portion of the radio frequency module.

Another aspect of this disclosure is a packaged radio frequency (RF)module that is partially shielded. The RF module includes a packagesubstrate, an RF shielding structure extending above the packagesubstrate, an RF component over the package substrate and in an interiorof the RF shielding structure, and an antenna on the package substrateexternal to the RF shielding structure.

FIG. 1 is a schematic diagram of an example RF module 10 that includesan RF component 12 and an integrated antenna 14 according to anembodiment. The RF module 10 can be a system in a package. FIG. 1 showsthe RF module 10 in plan view without a top shielding layer. The topshielding layer can be formed, for example, in accordance with any ofthe processes described with reference to FIG. 4A, FIG. 5A, FIG. 6A,FIG. 7A, or FIG. 8A. As illustrated, the RF module 10 includes the RFcomponent 12 on a package substrate 16, the antenna 14 on the packagesubstrate 16, and wire bonds 18 attached to the package substrate 16 andsurrounding the RF component 12. The antenna 14 of the RF module 10 isoutside of an RF shielding structure around the RF component 12.Accordingly, the antenna 14 can wirelessly receive and/or transmit RFsignals without being shielded by the shielding structure around the RFcomponent 12. At the same time, the shielding structure can provide RFisolation between the RF component 12 and the antenna 14 and/or otherelectronic components.

The RF component 12 can include any suitable circuitry configured toreceive, process, and/or provide an RF signal. For instance, the RFcomponent 12 can include an RF front end, a crystal, a system on a chip,or any combination thereof. In certain implementations, the RF component12 can include a power amplifier, a low-noise amplifier, an RF switch, afilter, a matching network, a crystal, or any combination thereof. An RFsignal can have a frequency in the range from about 30 kHz to 300 GHz.In accordance with certain communications standards, an RF signal can bein a range from about 450 MHz to about 6 GHz, in a range from about 700MHz to about 2.5 GHz, or in a range from about 2.4 GHz to about 2.5 GHz.In certain implementations, the RF component 12 can receive and/orprovide signals in accordance with a wireless personal area network(WPAN) standard, such as Bluetooth, ZigBee, Z-Wave, Wireless USB,INSTEON, IrDA, or Body Area Network. In some other implementations, theRF component and receive and/or provide signals in accordance with awireless local area network (WLAN) standard, such as Wi-Fi.

The antenna 14 can be any suitable antenna configured to receive and/ortransmit RF signals. The antenna 14 can be a folded monopole antenna incertain applications. The antenna 14 can be any suitable shape. Forinstance, the antenna 14 can have a meandering shape as shown in FIG. 1.In other embodiments, the antenna can be U-shaped, coil shaped, or anyother suitable shape for a particular application. The antenna 14 cantransmit and/or receive RF signals associated with the RF component 12.The antenna 14 can occupy any suitable amount of area of the packagingsubstrate 16. For instance, the antenna 14 can occupy from about 10% to75% of the area of the package substrate 16 in certain implementations.

The antenna 14 can be printed on the packaging substrate 16. A printedantenna can be formed from one or more conductive traces on thepackaging substrate 16. The one or more conductive traces can be formedby etching a metal pattern on the packaging substrate 16. A printedantenna can be a microstrip antenna. Printed antennas can bemanufactured relatively inexpensively and compactly due to, for example,their 2-dimensional physical geometries. Printed antennas can have arelatively high mechanical durability.

The package substrate 16 can be a laminate substrate. The packagesubstrate 16 can include one or more routing layers, one or moreinsulating layers, a ground plane, or any combination thereof. Incertain applications, the package substrate can include four layers. TheRF component 12 can be electrically connected to the antenna 14 by wayof metal routing in a routing layer of the packaging substrate 16 incertain applications.

The wire bonds 18 are part of an RF shielding structure around the RFcomponent 12. An RF shielding structure can be any shielding structureconfigured to provide suitable shielding associated with RF signals. Thewire bonds 18 can provide RF isolation between the antenna 14 and the RFcomponent 12 so as to prevent electromagnetic interference between thesecomponents from significantly impacting performance of the antenna 14 orthe RF component 12. The wire bonds 18 can surround the RF component 12as illustrated. The wire bonds 18 can be arranged around the RFcomponent 12 in any suitable arrangement, which can be rectangular asillustrated or non-rectangular in some other implementations. In the RFmodule 10 illustrated in FIG. 1, the wire bonds 18 form four wallsaround the RF component 12. The wire bonds 18 can be arranged such thatadjacent wire bonds are spaced apart from each other by a distance toprovide sufficient RF isolation between the RF component 12 and otherelectronic components.

FIG. 2 is a cross sectional view of the radio frequency module 10 ofFIG. 1 prior to forming a shielding layer over the radio frequencycomponent 12 according to an embodiment. As illustrated in FIG. 2,molding material 22 can be disposed over the RF component 12, the wirebonds 18, and the antenna 14. In FIG. 2, the RF component 12 includestwo die 12A and 12B on the package substrate 16. Upper portions 23 ofwire bonds 18 can extend above upper surface 24 of an overmold structureof the molding material 22 that is over the wire bonds 18. The wirebonds 18 can extend above the upper surface 24 to a top point 25 of thewire bonds 18. The upper portions 23 of the wire bonds 18 can be exposedby removing molding material after forming an overmold structure of themolding material 22. Having the upper portions 23 of the wire bonds 18exposed as shown in FIG. 2 can allow a conductive layer over the moldingmaterial 22 to be in contact with the wire bonds 18 to thereby providean electrical connection. FIG. 2 also illustrates vias 26 in the packagesubstrate 16. The wire bonds 18 can be electrically connected to aground plane 27 of the package substrate 16 by way of the vias 26. Thewire bonds 18 can be electrically connected to a ground contact of asystem board on which the module 10 is disposed by way of the vias 26.

FIG. 3 is a cross sectional view of the radio frequency module of FIG. 1with a shielding layer over the radio frequency component and not overthe antenna according to an embodiment. The RF module 10′ illustrated inFIG. 3 includes a shielding layer 32 formed over the upper surface 24 ofthe overmold structure over the RF component 12. The shielding layer 32is formed over a shielded portion of the RF module 10′ and an unshieldedportion of the RF module 10′ is left unshielded opposite the packagesubstrate 16. As illustrated, the antenna 14 is included in theunshielded portion of the RF module 10′. The shielding layer 32 isformed of electrically conductive material. As shown in FIG. 3, theshielding layer 32 is in contact with wire bonds 18.

A shielding structure around the RF component 12 includes the shieldinglayer 32 and the wire bonds 18. The shielding structure can also includevias 26 in the package substrate 16, a ground plane 27 in the packagesubstrate 16, ground pads and/or a ground plane of a system board onwhich the RF module 10 is disposed, or any combination thereof. RF Theshielding structure can function as a Faraday cage around the RFcomponent 12. The RF shielding structure can be configured at a groundpotential. The RF shielding structure around the RF component 12 canshield the RF component 12 from signals external to the shieldingstructure and/or shield circuits outside of the shielding structure fromthe RF component 12. The antenna 14 is external to the shieldingstructure in FIG. 3.

A shielding layer, such as the shielding layer 32 of FIG. 3, can beformed over a portion of an RF module and a different portion of the RFmodule can be unshielded opposite a package substrate. Prior to formingthe shielding layer over an RF module in any of the methods of formingthe shielding layer discussed herein, the RF module can have moldingmaterial over an antenna and wire bonds with exposed upper portions thatextend beyond of surface of an overmold structure of the moldingmaterial (e.g., as shown in FIG. 2). Examples methods of forming such ashielding layer will be discussed with reference to FIGS. 4A to 8I. RFmodules discussed herein can include a shielding layer formed by any ofthese methods as appropriate and/or by any suitable operations discussedwith reference to any of these methods. The shielding layer can beformed over a selected portion of an RF module by an additive process ora subtractive process. The methods of forming shielding layers discussedherein can be implemented in high volume manufacturing. Such methods canbe automated in an accurate and repeatable manner.

FIG. 4A is a flow diagram of an illustrative process 40 that includesforming a shielding layer over a radio frequency component of a moduleand leaving an antenna unshielded according to an embodiment. Theprocess 40 involves forming a shielding layer over a portion of an RFmodule by a subtractive method. In the process 40, a shielding layer canbe formed over a plurality of RF modules, such as RF modules of a strip,concurrently. A conductive layer can be formed over the RF modules andthe conductive layer can be removed over a selected portion of each ofthe RF modules using a laser. Methods of forming a shielding layerinvolving laser removal of a portion of a conductive layer can beadvantageous for manufacturing RF modules that are relatively small insize. FIGS. 4B to 4E illustrate an example module or strip of modulescorresponding to various stages of the process of FIG. 4A according toan embodiment.

At block 42, RF modules that include an RF component and an integratedantenna are provided. The RF modules can include one or more conductivefeatures, such as wire bonds, disposed between the RF component and theantenna. The conductive features are RF isolation structures that areincluded in a shielding structure. FIG. 4B illustrates an example RFmodule 10A that can be provided at block 42. The RF module 10A cancorrespond to the RF module 10 of FIGS. 1 and 2. As illustrated, the RFmodule 10A of FIG. 4B includes an RF component 12 that includescomponents 12A, 12B, and 12C. As also illustrated in FIG. 4B, the wirebonds 18 can surround the RF component. Upper portions of the wire bonds18 can be exposed, for example, as illustrated in FIG. 2.

A conductive layer can be formed over RF modules at block 44. Theconductive layer can be in contact with wire bonds of the RF modules.The conductive layer can be a conformal layer formed by physical vapordeposition (PVD). A conductive material can be sputtered over a strip ofRF modules. A strip of RF module can be any suitable array of multipleRF modules that are processed together. Sputtering can provide aconductive layer than is smoother than conductive layers formed by someother processes. The conductive material layer can include any suitableconductive material for RF shielding. For example, the conductivematerial can be copper. Copper can provide desirable electromagneticinterference shielding and copper is also relatively inexpensive.Another example conductive material for the conductive layer is tungstennickel. A protective layer can be formed over the conductive layer. Thiscan prevent corrosion of the conductive layer. As an example, a titaniumlayer can be provided over a copper conductive layer to protect thecopper. FIG. 4C shows a strip of RF modules 43 with a conductive layer41 formed over the entire upper surface of the strip of RF modules 43.

At block 46, the conductive layer can be removed over an antenna of anRF module. For instance, a laser can remove the conductive layer overthe antenna of the RF module. The laser can remove any suitable portionof the conductive layer over the RF module. Laser beams can be appliedconcurrently to two or more RF modules of the group of RF modules. Forinstances, portions of the conductive layer over an antenna of each ofthe RF modules of the strip of RF modules can be removed concurrently.In some instances, laser beams can be applied sequentially to differentRF modules of the group of RF modules. Removing a portion of theconductive layer with a laser can leave features on the RF module. Forexample, burn features, such as a halo ring, can be present on an RFcomponent after laser removal of a portion of the conductive layer.Laser removal can result in a rougher surface finish over the antennarelative to some other methods of forming a partially shielded RFmodule, such as methods that involve masking.

FIG. 4D shows a laser beam 45 being applied to an RF module to remove aportion of the conductive layer 41. The laser can selectively remove theconductive layer over the RF module such that the RF module is left withan unshielded portion 47 and a shielded portion 49. Accordingly, ashielding layer can be disposed over the RF component and the antennacan be unshielded opposite the package substrate. As such, the antennacan transmit and/or receive RF signals without the shielding layerinterfering. While FIG. 4D illustrates the laser beam 45 being appliedto one module, laser beams are applied to a group of RF modules at block46 of the process 46.

Referring to FIG. 4A, the strip of RF modules can be singulated intoindividual RF modules at block 48. Accordingly, singulation can occurafter forming a shielding layer over a portion of an RF module. FIG. 4Eshows a singulated RF module 10A′ that includes a shielding layer over aportion of the packaging substrate.

FIG. 5A is a flow diagram of an illustrative process 50 that includesforming a shielding layer over a radio frequency component of a moduleand leaving an antenna unshielded according to an embodiment. Theprocess 50 involves forming a shielding layer over a portion of an RFmodule by an additive method. In the process 50, masking material can beapplied over selected portions of a plurality of RF modules of a strip,a conductive layer can be formed over the RF modules and the maskingmaterial, and the masking material can be removed. Methods of forming ashielding layer involving masking can be advantageous for manufacturingRF modules that are relatively large in size and/or for forming ashielding layer for a relatively small number of RF modulesconcurrently. FIGS. 5B to 5F illustrate an example module or strip ofmodules corresponding to various stages of the process of FIG. 5Aaccording to an embodiment.

At block 51, RF modules that include an RF component and an integratedantenna are provided. The RF modules can include one or more conductivefeatures, such as wire bonds, disposed between the RF component and theantenna. The conductive features are RF isolation structures that areincluded in a shielding structure. FIG. 5B illustrates an example RFmodule 10A that can be provided at block 51. The RF module 10A cancorrespond to the RF module 10 of FIGS. 1 and 2. The RF module 10A ofFIG. 5B can also correspond to the RF module 10A of FIG. 4B. Asillustrated, the RF module 10A of FIG. 5B includes an RF component 12that includes components 12A, 12B, and 12C. As also illustrated in FIG.5B, the wire bonds 18 can surround the RF component.

A masking material can be provided over selected portions of RF modulesat block 53. A strip of RF modules can be masked concurrently and/orsequentially at block 53. The masking material can be relatively hightemperature tape. The masking material can be applied over the antennaof each of the RF modules of a strip of RF modules. FIG. 5C shows astrip 52 of RF modules with masking material 54 formed over a selectedportion of each RF module of the strip 52.

At block 55, a conductive layer is formed over the strip of RF modules.The conductive layer can be in contact with wire bonds of the RFmodules. The conductive layer can be formed by way of PVD or sprayingconductive material over the strip of RF modules. For example, theconductive layer can be formed in accordance with any of the principlesand advantages discussed with reference to block 44 of the process 40.As another example, the conductive layer can be formed by sprayingconductive paint, such as silver (Ag) based conductive paint, over thestrip of RF modules. FIG. 5D shows a strip 52′ of RF modules with a topsurface covered by a conductive layer 41.

The masking material is removed at block 57. For instance, tape can beremoved in any suitable manner. By removing the masking material,portions of the conductive layer that were formed over the maskingmaterial are also removed. Accordingly, the portion of the RF modulethat was covered by the masking material can be unshielded opposite thepackaging substrate. Removing the masking material can leave features onthe RF module. For example, a whisker feature and/or a relatively sharpstep can be present from removing the masking material. FIG. 5E shows astrip 52″ of RF modules with a top surface having shielded portions 49and unshielded portions 47. In the shielded portions 49, a shieldinglayer 32 is included in a shielding structure around the RF component 12of each RF module.

The strip of RF modules can be singulated into individual RF modules atblock 58. In the process 50, singulation is performed after forming ashielding layer over a portion of an RF module. FIG. 5F shows an RFmodule 10A′ that includes a shielding layer over a portion of thepackaging substrate. The RF module 10A′ of FIG. 5F can be similar to theRF module 10A′ of FIG. 4E except that the RF module 10A′ of FIG. 5F caninclude features resulting from removing a mask over the antenna and theRF module 10A′ of FIG. 4E can include features resulting from laserremoval of material of the shielding layer over the antenna.

Certain processes, such as the process 50 of FIG. 5A and the process 60of FIG. 6B, include forming a shielding layer prior to singulation of RFmodules. In some other processes, the shielding layer can be formedafter singulation of RF modules. In such processes, a conformalstructure can be formed along one or more edges of a singulated modulewhile forming a conductive layer over the singulated module. Theconformal structure can be included in a shielding structure around anRF component. The conformal structure implemented in place of wire bondsalong one or more sides of an RF component. FIGS. 6A, 7A, and 8A areexamples of processes that include forming a shielding layer aftersingulation of RF modules.

FIG. 6A is a flow diagram of an illustrative process 60 that includesforming a shielding layer over a radio frequency component of a moduleand leaving an antenna unshielded according to an embodiment. Theprocess 60 involves forming a shielding layer over a portion of an RFmodule by an additive method. In the process 60, masking material can beapplied over selected portions of a plurality of RF modules of a strip,the RF modules can be singulated, a conductive layer can be formed overthe RF modules and the masking material, and the masking material can beremoved. FIGS. 6B to 6F illustrate an example module, strip of modules,or group of singulated modules corresponding to various stages of theprocess of FIG. 6A according to an embodiment.

At block 61, RF modules that include an RF component and an integratedantenna are provided. The RF modules can include one or more conductivefeatures, such as wire bonds, disposed between the RF component and theantenna. The conductive features are RF isolation structures that areincluded in a shielding structure. FIG. 6B illustrates an example RFmodule 10B that can be provided at block 61. The RF module 10B cangenerally correspond to the RF module 10 of FIGS. 1 and 2 and the RFmodule 10A of FIGS. 4B and 5B. The RF module 10B includes wire bonds 18around fewer sides of the RF component 12 than the RF modules 10 and10A. As illustrated in FIG. 6B, the wire bonds 18 are disposed betweenthe RF component 12 and the antenna 14. The illustrated wire bonds 18form a wall of wire bonds between the RF component 12 and the antenna14. As also illustrated, the RF module 10B of FIG. 6B includes an RFcomponent 12 that includes components 12A, 12B, and 12C.

A masking material can be provided over selected portions of RF modulesat block 63. A strip of RF modules can be masked concurrently and/orsequentially at block 63. The masking material can be relatively hightemperature tape. The masking material can be relatively low adhesiontape. The masking material can be applied over the antenna of each ofthe RF modules of a strip of RF modules. FIG. 6C shows a strip 52 of RFmodules with masking material 54 formed over a selected portion of eachRF module of the strip 52.

At block 65, RF modules can be singulated. For instance, a jig saw canseparate individual RF modules from each other. The singulated RFmodules can be provided to a PVD ring. FIG. 6D shows a group ofsingulated RF modules 66 prior to a shielding layer being formedthereon.

A conductive layer is formed over the singulated RF modules at block 67.The conductive layer can be in contact with wire bonds of a singulatedRF module. The conductive layer can be formed by way of sputtering. Forexample, the conductive layer can be formed in accordance with any ofthe principles and advantages discussed with reference to block 44 ofthe process 40 as applied to singulated modules. FIG. 6E shows a groupof singulated RF modules 66′ with a conductive layer formed thereon. Theconductive layer is substantially parallel to a package substrate of theRF module.

At block 67, conformal conductive layers can also be formed along edgesof singulated RF modules. The conformal conductive layers can besubstantially orthogonal to and in contact with the conductive layerthat is substantially parallel to the package substrate. Accordingly,the shielding structure around the RF component can include the wirebonds 18 around one side of the RF component, conformal conductivelayers around three sides of the RF component, and a shielding layerover the RF component. In other embodiments, wire bonds can be disposedalong two or three sides of the RF component and conformal conductivelayers can be disposed along the other side(s) of the RF component.Examples of such embodiments correspond to FIGS. 9E and 9F.

The masking material is removed at block 69. The masking material can beremoved while the singulated RF modules are picked and placed into atray. The masking material can be removed in any suitable manner, suchas peeling the masking material or dissolving the masking material. Byremoving the masking material, portions of the conductive layer thatwere formed over the masking material are removed. Accordingly, theportion of the RF module that was covered by the masking material can beunshielded opposite the packaging substrate. Removing the maskingmaterial can leave features on the RF module. For example, a whiskerfeature and/or a relatively sharp step can be present from removing themasking material. FIG. 6F shows an RF module 10B′ that includes ashielding layer over a portion of the packaging substrate.

FIG. 7A is a flow diagram of an illustrative process 70 that includesforming a shielding layer over a radio frequency component of a moduleand leaving an antenna unshielded according to an embodiment. Theprocess 70 involves forming a shielding layer over a portion of an RFmodule by a subtractive method. For instance, a selected portion of aconductive layer of a singulated RF module can be removed using a laserin the process 70 instead of by masking in the process 60 of FIG. 6. Theprocess 70 involves forming a conductive layer over the singulated RFmodules and then removing a selected portion of the conductive layer.FIGS. 7B to 7F illustrate an example module or group of singulatedmodules corresponding to various stages of the process of FIG. 7Aaccording to an embodiment.

At block 71, RF modules that include an RF component and an integratedantenna are provided. The RF modules can include one or more conductivefeatures, such as wire bonds, disposed between the RF component and theantenna. The conductive features are RF isolation structures that areincluded in a shielding structure. FIG. 7B illustrates an example RFmodule 10B that can be proved at block 71. The RF module 10B cangenerally correspond to the RF module 10 of FIGS. 1 and 2 and the RFmodule 10A of FIGS. 4B and 5B. The RF module 10B of FIG. 7B cancorrespond to the RF module 10B of FIG. 6B. As illustrated, the RFmodule 10B of FIG. 7B includes an RF component 12 that includescomponents 12A, 12B, and 12C. As also illustrated in FIG. 7B, the wirebonds 18 are disposed between the RF component 12 and the antenna 14.The illustrated wire bonds 18 form a wall of wire bonds between the RFcomponent 12 and the antenna 14.

RF modules can be singulated at block 73. For instance, a jig saw canseparate individual RF modules from each other. The singulated RFmodules can be provided to a PVD ring. FIG. 7B shows a group ofsingulated RF modules 74 prior to a conductive layer being formedthereon. The RF modules 74 can correspond to the RF modules 66 of FIG.6D without masking material formed thereon.

A conductive layer is formed over the singulated RF modules at block 75.The conductive layer can be in contact with wire bonds of the singulatedRF module. The conductive layer can be formed by way of sputtering. Forexample, the conductive layer can be formed in accordance with any ofthe principles and advantages discussed with reference to block 44 ofthe process 40 as applied to singulated modules. FIG. 7C shows a groupof singulated RF modules 74′ with a conductive layer formed thereon. Theconductive layer is substantially parallel to a package substrate of theRF module.

At block 75, conformal conductive layers can also be formed along edgesof singulated RF modules. The conformal conductive layers can besubstantially orthogonal to and in contact with the conductive layerthat is substantially parallel to the package substrate. Accordingly,the shielding structure around the RF component can include the wirebonds 18 around one side of the RF component, conformal conductivelayers around three sides of the RF component, and a shielding layerover the RF component. In other embodiments, wire bonds can be disposedalong two or three sides of the RF component and conformal conductivelayers can be disposed along the other side(s) of the RF component.Examples of such embodiments correspond to FIGS. 9E and 9F.

A selected portion of the conductive layer can be removed over anantenna of an RF module at block 77. For instance, a laser can removethe conductive layer over the antenna of the RF module. Removing aportion of the conductive layer with a laser can leave features on theRF module. For example, burn features, such as a halo ring, can bepresent on an RF component after laser removal of a portion of theconductive layer. Laser removal can result in a rougher surface finishover the antenna relative to some other methods of forming a partiallyshielded RF module, such as methods that involve masking. The laserremoval can involve any of the principles and discussed with referenceto block 46 of the process 40 as applied to laser removal of a selectedportion of a conductive layer of one or more singulated RF modules. Inthe process 70, laser removal is performed after singulation. Bycontrast, in the process 40, laser removal of a selected portion of theconductive layer is performed prior to singulation.

FIG. 7E shows a laser beam 45 being applied to a singulated RF module.The laser can selectively remove the conductive layer over the RF moduleso that the RF module is left with an unshielded portion 47 and ashielded portion 49. Accordingly, a shielding layer can be disposed overthe RF component and the antenna can be unshielded opposite the packagesubstrate. As such, the antenna can transmit and/or receive RF signalswithout the shielding layer interfering.

At block 77, singulated RF modules are picked and placed into a tray.FIG. 7F shows an RF module 10B′ that includes a shielding layer over aportion of the packaging substrate that includes an RF component.

FIG. 8A is a flow diagram of an illustrative process 80 that includesforming a shielding layer over a radio frequency component of a moduleand leaving an antenna unshielded according to an embodiment. Theprocess 80 involves forming a shielding layer over a portion of an RFmodule by an additive method. Masking material can be applied over apanel of RF modules, the masking material can be cut and a portion ofthe masking material can be removed, a conductive layer can be formed,and the remaining masking material can be removed. FIGS. 8B to 8Iillustrate an example module, strip of modules, or group of singulatedmodules corresponding to various stages of the process of FIG. 8Aaccording to an embodiment.

At block 81, RF modules that include an RF component and an integratedantenna are provided. The RF modules can include one or more conductivefeatures, such as wire bonds, disposed between the RF component and theantenna. The conductive features are RF isolation structures that areincluded in a shielding structure. FIG. 8B illustrates an example RFmodule 10B that can be provided at block 81. The RF module 10B cangenerally correspond to the RF module 10 of FIGS. 1 and 2 and the RFmodule 10A of FIGS. 4B and 5B. The RF module 10B of FIG. 8B cancorrespond to the RF module 10B of FIG. 6B and the RF module 10B of FIG.7B. As illustrated, the RF module 10B of FIG. 8B includes an RFcomponent 12 that includes components 12A, 12B, and 12C. As illustratedin FIG. 8B, the wire bonds 18 are disposed between the RF component 10Band the antenna 14. The illustrated wire bonds 18 form a wall of wirebonds between the RF component 10B and the antenna 14.

A masking material can be provided over RF modules at block 83. Themasking material can cover a strip of RF modules. The masking materialcan include any suitable features of the masking materials discussedherein. FIG. 8C shows a strip 82 of RF modules with masking material 54formed over the top surface of each of the RF modules of the strip 52.While the masking material is formed over the entire top surface of theRF modules in FIG. 8C, the masking material can be formed over anysuitable portion of the top surface of the RF modules in some otherembodiments.

The masking material can be laser cut at block 85. The masking materialcan be laser cut such that masking material can be over the RF modulesin any desired shape. Such desired shapes may be rectangular. In someother embodiments, the desired shapes can be non-rectangular. Forinstance, curved features, circular features, elliptical features,non-rectangular polygonal features, or any combination thereof can belaser cut. FIG. 8D shows a strip 82′ of RF modules with masking material54 that is laser cut.

At block 87, a portion of the masking material can be removed.Accordingly, masking material can remain over a portion of an RF modulethat will be unshielded after the process 80. For instance, the maskingmaterial can remain over the antenna of an RF module. FIG. 8E shows astrip 82″ of RF modules with masking material 54 after partial removal.

RF modules can be singulated at block 89. For instance, a jig saw canseparate individual RF modules from each other. The singulated RFmodules can be provided to a PVD ring. FIG. 8F shows a group ofsingulated RF modules 90 prior to a conductive layer being formedthereon. FIG. 8G shows a singulated RF module with masking material 54over a portion that will be unshielded after the process 80. The groupof singulated RF modules 90 can include a plurality of such modules. TheRF modules 90 can correspond to the RF modules 66 of FIG. 6D with adifferent pattern of masking material formed thereon.

A conductive layer is formed over the singulated RF modules at block 91.The conductive layer can be in contact with wire bonds of a singulatedRF module. The conductive layer can be sputtered over the RF modules.The conductive layer can be formed by way of PVD. For example, theconductive layer can be formed in accordance with any of the principlesand advantages discussed with reference to forming the conductive layerin any of the methods discussed herein as suitable. FIG. 8H shows agroup of singulated RF modules 90′ with conductive layers formedthereon. The conductive layer of each RF module is substantiallyparallel to a package substrate of the RF module.

At block 91, conformal conductive layers can also be formed along edgesof singulated RF modules. The conformal conductive layers can besubstantially orthogonal to and in contact with the conductive layerthat is substantially parallel to the package substrate. Accordingly,the shielding structure around the RF component can include the wirebonds 18 around one side of the RF component, conformal conductivelayers around three sides of the RF component, and a shielding layerover the RF component. In other embodiments, wire bonds can be disposedalong two or three sides of the RF component and conformal conductivelayers can be disposed along the other side(s) of the RF component.Examples of such embodiments correspond to FIGS. 9E and 9F.

The remaining masking material is removed at block 93. The maskingmaterial can be removed in any suitable manner. By removing the maskingmaterial, portions of the conductive layer that were formed over themasking material are removed. Accordingly, the portion of the RF modulethat was covered by the masking material can be unshielded opposite thepackaging substrate. Removing the masking material can leave features onthe RF module. For example, a whisker feature and/or a relatively sharpstep can be present from removing the masking material. FIG. 8I shows aRF module 10B′ with a top surface having a shielded portion and anunshielded portion. In the shielded portion, a shielding layer can beincluded in a shielding structure around an RF component. The antenna ofthe RF module can be unshielded opposite the package substrate in theunshielded portion.

At block 95, singulated RF modules are picked and placed into a tray.

FIGS. 9A to 9F are schematic diagrams of examples of selectivelyshielded RF modules according to certain embodiments. Any of theprinciples and advantages discussed in connection with any of theseembodiments can be implemented in connection with any other of theseembodiments and/or any other embodiments discussed herein as suitable.Similar to FIG. 1, the RF modules of FIGS. 9A to 9F are shown in planview without a top shielding layer. The top shielding layer can beformed, for example, in accordance with any of the principles andadvantages discussed with reference to one or more of the processes ofFIG. 4A, FIG. 5A, FIG. 6A, FIG. 7A, or FIG. 8A. A shielding layer can beformed over the RF component of each of these RF modules and the antennaof each of these RF modules can be unshielded. Wire bonds of each ofthese modules can be in contact with the shielding layer such that boththe wire bonds and the shielding layer are part of a shielding structurearound an RF component. Although FIGS. 9A to 9F illustrate RF moduleswith a single antenna, any suitable principles and advantages discussedherein can be applied to RF modules that include two or more integratedantennas.

FIGS. 9A to 9F illustrate various RF modules in accordance with theprinciples and advantages discussed herein. Each of these RF modules canbe selectively shielded in accordance with any suitable principles andadvantages discussed herein. FIGS. 9A to 9F illustrate that various RFcomponents can be implemented within a shielding structure, that variousshielding structures can be implemented, that antennas can have variousshapes and/or positions, or any suitable combination thereof. Forinstance, FIG. 9A shows an example of an RF component that includesthree different elements. Other RF components can alternatively oradditionally be implemented. FIGS. 9B, 9C, 9E, and 9F show thatshielding structures can include one, two, or three walls of wire bondsand conductive conformal structure(s) can be disposed along other sidesof the RF module to shield the RF component. Wire bonds can surround theRF component of the RF module in embodiments in which a shielding layeris formed prior to singulation of the RF modules. A conformal layer canbe disposed along at least one side the RF component of the RF module inembodiments in which a shielding layer is formed after singulation ofthe RF modules. The conformal structure can include any suitableconductive material. For example, the conductive conformal structure caninclude the same conductive material as the shielding layer in certainapplications. FIGS. 9D, 9E, and 9F show example antenna positions andshapes. Any of the RF modules discussed herein can include an antennathat is suitably positioned and of any suitable size and shape for aparticular application.

FIG. 9A is a schematic diagram of an example RF module 10A according toan embodiment. The RF module 10A of FIG. 9A shows that the RF component12 of FIG. 1 can include a system on a chip 12A, a front end integratedcircuit 12B, and a crystal 12C. The RF module 10A of FIG. 9A is anexample of an RF module that can be provided in the process 40 of FIG.4A and/or in the process 50 of FIG. 5A.

FIG. 9B is a schematic diagram of an example RF module 10B according toan embodiment. The RF module 10B of FIG. 9B is an example of an RFmodule that can be provided in the process 60 of FIG. 6A, the process 70of FIG. 7A, or the process 80 of FIG. 8A. The RF module 10B of FIG. 9Bis like the RF module 10 of FIG. 1 except that wire bonds 18 are notsurrounding the RF component 12. In FIG. 9B, wire bonds 18 are disposedbetween the RF component 12 and the antenna 14. The remaining sidesaround the RF component in FIG. 9B are free from wire bonds.

FIG. 9C shows the radio frequency module of FIG. 9B after a shieldinglayer 32 and a conductive conformal structure 98 are formed. Asillustrated in FIG. 9C, the conductive conformal structure 98 can beformed along the outer edges of the module 10B′. Such a conductiveconformal structure can be formed, for example, as described inconnection with the process 60 of FIG. 6A, the process 70 of FIG. 7A, orthe process 80 of FIG. 8A. Accordingly, the shielding structure aroundthe RF component 12 in FIG. 9C includes wire bonds 18 disposed betweenthe RF component 12 and the antenna 14 and a conductive conformalstructure 98 that includes three conformal conductive sides along edgesof the RF module 10B′. The wire bonds 18 and the conformal conductivesurfaces can be in contact with the shielding layer 32 disposed over theRF component 12. The wire bonds 18 illustrated in FIGS. 9B and 9C arearranged as a wall. In some other instances, the conductive conformalstructure can also be along edges of the module 10B′ around the antenna14. The shielding layer can be formed over the RF component 12 and theantenna 14 can be unshielded opposite the package substrate 16.

FIG. 9D is a schematic diagram of an example RF module 10C according toan embodiment. The RF module 10C of FIG. 9D is like the RF module 10 ofFIG. 1 except that an antenna 14A surrounds the RF component 12 and theantenna 14A has a different shape than the antenna 14 of FIG. 1. Ashielding layer opposite the package substrate 16 can shield the RFcomponent 12 and leave the antenna 14A unshielded.

FIG. 9E is a schematic diagram of an example RF module 10D according toan embodiment. The RF module 10D of FIG. 9E is like the RF module 10 ofFIG. 1 except both the shielding structure and the antenna aredifferent. In the RF module 10D shown in FIG. 9E, the shieldingstructure includes three walls of wire bonds 18 around the RF component12. A conformal conductive layer can be formed along the side that isfree from wire bonds. The conformal conductive layer and a shieldinglayer can be included in the shielding structure. The antenna 14B has adifferent position and shape than the antenna 14 of FIG. 1. The antenna14B shown in FIG. 9E is disposed around three of four side of the RFcomponent 12. A shielding layer opposite the package substrate 16 canshield the RF component 12 and leave the antenna 14B unshielded.

FIG. 9F is a schematic diagram of an example RF module 10E according toan embodiment. The RF module 10E of FIG. 9F is like the RF module 10 ofFIG. 1 except the shielding structure and the antenna are different. Inthe RF module 10E shown in FIG. 9F, the shielding structure includes twowalls of wire bonds 18 around the RF component 12. A conformalconductive layer can be formed along the sides that are free from wirebonds. The conformal conductive layer and a shielding layer can beincluded in the shielding structure. The antenna 14C has a differentposition and shape than the antenna 14 of FIG. 1. The antenna 14C shownin FIG. 9F is disposed around two of four sides of the RF component 12.A shielding layer opposite the package substrate 16 can shield the RFcomponent 12 and leave the antenna 14C unshielded.

Radio frequency modules can be selectively shielded such that ashielding layer opposite a package substrate covers any suitable portionof the radio frequency module. Such a shielding layer can have anysuitable pattern for a desired application. The pattern can be formed byablating conductive material, such as by laser scribing, and/or byremoving a mask to remove conductive material. The pattern can have anysuitable shape and/or size. For instance, such a pattern could cover anRF component shown in any of FIGS. 9A to 9F.

The unshielded portion of the radio frequency module can be exposed byablation. An ablation pattern can be any suitable pattern for a desiredapplication. For example, the ablation pattern can be a line, multiplelines such as multiple intersecting lines, a block, etc. Removingmasking material can alternatively perform a similar function asablating conductive material. Accordingly, an unshielded portion of aradio frequency module can have a shape of one or more lines and/or oneor more blocks in plan view. In some instances, an unshielded portion ofa radio frequency module can separate different shielded portions of theradio frequency module.

While the radio frequency modules of FIGS. 9A to 9F include anunshielded portion over an antenna, an unshielded portion can be overone or more other circuit elements (such as one or more matchingcircuits, one or more filters, one or more duplexers, the like, or anysuitable combination thereof) and/or between circuitry of differentportions of a radio frequency module. In certain applications, shieldingstructures can be segmented to keep one portion of a radio frequencymodule from interfering with another portion of the radio frequencymodule.

FIGS. 9G to 9J are diagrams of examples of selectively shielded RFmodules according to certain embodiments. Any of the principles andadvantages discussed in connection with any of these embodiments can beimplemented in connection with any other of these embodiments and/or anyother embodiments discussed herein as suitable. For instance, the topshielding layers of FIGS. 9G to 9J can be formed in accordance with anysuitable principles and advantages discussed with reference to one ormore of FIG. 4A, FIG. 5A, FIG. 6A, FIG. 7A, or FIG. 8A.

FIG. 9G illustrates a shielded radio frequency module 10F′ with anablation pattern leaving a portion of the radio frequency moduleunshielded according to an embodiment. The ablation pattern can extendover a top of the radio frequency module 10F′ and also over opposingsides of the radio frequency module 10F′. The ablation pattern can beformed by laser scribing, for example. Such laser scribing can removeconductive material and leave an unshielded portion 47A that is freefrom the conductive material over a molding material. The laser scribingcan also remove some molding material (e.g., about 5 microns of moldingmaterial) in the unshielded portion 47A. A width of the illustratedablation pattern can be in a range from about 40 to 150 microns, such asabout 100 microns, in certain applications.

As shown in FIG. 9G, unshielded portion 47A separates a first shieldingstructure from a second shielding structure. The first shieldingstructure can provide shielding for an RF component. The illustratedfirst shielding structure includes a top shielding layer 32A and threeconformal sides. The three conformal sides can be substantiallyorthogonal to the top shielding layer 32A. The conformal sides can beconnected to ground and provide a ground connection for the topshielding layer 32A. The first shielding structure can also include wirebonds on the fourth side adjacent to the unshielded portion 47A. Suchwire bonds can be in contact with the top shielding layer 32A.Alternatively, a conductive conformal structure can be formed along thefourth side and in contact with the top shielding layer 32A. The secondshielding structure can provide shielding for another electroniccomponent, such as another RF component. The illustrated secondshielding structure includes a top shielding layer 32B and threeconformal sides. The three conformal sides can be substantiallyorthogonal to the top shielding layer 32B. The conformal sides can beconnected to ground and provide a ground connection for the topshielding layer 32B. The second shielding structure can also includewire bonds on the fourth side adjacent to the unshielded portion 47A.Such wire bonds can be in contact with the top shielding layer 32B.Alternatively, a conductive conformal structure can be formed along thefourth side and in contact with the top shielding layer 32B. In certainapplications, the first shielding structure and the second shieldingstructure are both open on opposing sides of the unshielded portion 47Ain a direction substantially orthogonal to the top shielding layers.

FIG. 9H illustrates a selectively shielded radio frequency module 10G′according to an embodiment. In FIG. 9H, the unshielded portion 47A iswider than in FIG. 9G. The unshielded portion 47A can have a width in arange from about 300 microns to 700 microns, such as about 500 microns.The unshielded portion 47A can have any suitable dimension for aparticular application.

FIG. 9I illustrates a selectively shielded radio frequency module 10H′with an unshielded portion 47A between two shielded portions accordingto an embodiment. The radio frequency module 10H′ illustrates that twoRF components of the same radio frequency module can shielded bydifferent shielding structures. These RF components can be any suitableRF components, such as RF components operating in different frequencybands (e.g., a high band and a low band). In the radio frequency module10H′, a first shielding structure provides shielding for a first RFcomponent 12-1 and a second shielding structure provides shielding for asecond RF component 12-2. The shielding structures of the radiofrequency module 10H′ can reduce and/or eliminate inference between thefirst RF component 12-1 and the second RF component 12-2. The first RFcomponent 12-1 is positioned between a top shielding layer 32A of thefirst shielding structure and a package substrate. The second RFcomponent 12-2 is positioned between a top shielding layer 32B of thesecond shielding structure and the package substrate.

Conformal layers can form at least three sides of the first shieldingstructure of the radio frequency module 10H′. Similarly, conformallayers can form at least three sides of the second shielding structureof the radio frequency module 10H′. In certain applications, the firstshielding structure and the second shielding structure are both open onopposing sides of the unshielded portion 47A in a directionsubstantially orthogonal to the top shielding layers. In some instances,one or more conductive features can be disposed between the first RFcomponent 12-1 and the second RF component 12-B. For example, the firstshielding structure can include one or more wire bonds disposed betweenthe RF component 12-1 and the unshielded portion 47A, in which the oneor more wire bonds are in contact with the top shielding layer 32A.Alternatively or additionally, the second shielding structure caninclude one or more wire bonds disposed between the RF component 12-2and the unshielded portion 47A, in which the one or more wire bonds arein contact with the top shielding layer 32B. As another example, thefirst shielding structure can include a conformal structure disposedbetween the RF component 12-1 and the unshielded portion 47A and/or thesecond shielding structure can include a conformal structure disposedbetween the RF component 12-2 and the unshielded portion 47A. Such aconformal structure can be formed in accordance with any suitableprinciples and advantages discussed with reference to FIGS. 13A and 13B,for example. In some applications, laser scribing can remove conductivematerial within a through mold via so that the bottom of the throughmold via can correspond to the unshielded portion 47A.

FIG. 9J illustrates a selectively shielded radio frequency module 10I′with an unshielded portion between shielded portions according to anembodiment. The radio frequency module 10I′ illustrates another exampleunshielded portion 47B and example RF components 12-1, 12-2A and 12-2B,and 12-3. The unshielded portion 47B can be formed by ablating aconductive material over the module with a laser scribe, for example. Asillustrated by FIG. 9J, the unshielded portion 47B can segment ashielding structure into more than two separate shielding structures.The radio frequency module 10I′ is an example in which 3 differentcomponents are packaged together (SoC 12-1, front end 12-2A and SOC12-2, and crystal 12-3) and are separated from each other by theunshielded portion 47B. In some embodiments, one or more conductivefeatures in contact with a top shielding layer can be on one or bothsides of some or all of the unshielded portion 47B. The one or moreconductive features can include one or more wire bonds and/or aconformal structure.

Integrated antennas can be printed on a package substrate, for example,as discussed above. In certain embodiments, an integrated antenna can bea multi-layer antenna. For instance, a portion of an integrated antennacan be on a surface of a package substrate and another portion of theintegrated antenna can be implemented in another layer above or belowthe portion of the integrated antenna on the surface of the packagesubstrate. As an example, a portion of an integrated antenna can beprinted on a first side of a package substrate and another portion ofthe integrated antenna can be on a second side of the package substrate,in which the first side opposes the second side. As another example, ofan integrated antenna can be printed on a first side of a packagesubstrate and another portion of the integrated antenna can beimplemented over a molding layer of a radio frequency module. In someapplications, a multi-layer antenna can implement an antenna in asmaller foot print relative to similar a single layer antenna. This canreduce a footprint of the antenna and consequently reduce a footprint ofa radio frequency module that includes the antenna.

FIGS. 10A and 10B illustrate a radio frequency module 100 that includesan integrated antenna implemented on opposing sides of a packagesubstrate 16. The illustrated integrated antenna is multi-layer antenna.Any suitable principles and advantages of the RF module 100 can beimplemented in combination with any of the other embodiments discussedherein. The antenna can include traces on opposing sides of the packagesubstrate. FIG. 10A is a top view of the radio frequency module 100.FIG. 10B is a bottom view of the radio frequency module 100.

As shown in FIG. 10A, a first portion 104A of an antenna can be on afirst side of a packaging substrate on which the RF component 12 is alsodisposed. The first portion 104A can be implemented by a conductivetrace. The first portion 104A of the antenna can be electricallyconnected to a second portion 104B of the antenna by one or more viasthat extends through the packaging substrate 16. The first portion 104Aand the second portion 104B can together implement the antenna of the RFmodule 100.

As shown in FIG. 10B, the second portion 104B of the antenna can be onan opposite side of the packaging substrate 16 than the first portion104A. The second portion 104A can be implemented by a conductive trace.One or more pads can be disposed on the second portion 104A of theantenna. As also shown in FIG. 10B, pads 108A to 108E can be contactwith the second portion 104A of the antenna. The pads 108A to 108E canbe exposed for providing connections between the antenna and a systemboard on which the RF module 110 is disposed. The pads 108A to 108E canbe soldered to the system board. One or more of the pads 108A to 108Ecan serve as an anchor point to align the antenna of the RF module 100with the system board.

Referring back to FIG. 10A, the illustrated RF module 100 includes amatching circuit 106 that is implemented on the packaging substrate 16external to the shielding structure. The illustrated matching circuit106 is electrically connected to the antenna. The matching circuit 106can provide impedance matching associated with the antenna. The matchingcircuit 106 can include any suitable matching circuit elements, such asone or more capacitors and/or one or more inductors. As illustrated, thematching circuit 106 includes three passive circuit elements 106A, 106B,and 106C. The matching circuit 106 can include more or fewer circuitelements in other applications. For instance, a matching circuit caninclude two inductors in certain applications. The matching circuit 106can have a relatively high activity factor. Accordingly, implementingthe matching circuit 106 external to the shielding structure can allowheat associated with the matching circuit 106 to dissipate outside ofthe shielding structure.

FIGS. 11A and 11B illustrate a radio frequency module 110 that includesan integrated antenna partially implemented over molding material 22.The illustrated integrated antenna is multi-layer antenna. Any suitableprinciples and advantages of the RF module 110 can be implemented incombination with any of the other embodiments discussed herein. FIG. 11Ashows a partial view of the RF module 110 with molding material omittedfor illustrative purposes. FIG. 11B shows a view of the RF module 110with the molding material 22. In FIGS. 11A and 11B, the antenna includesa first portion 114A and a second portion 114B. The first portion 114Acan be a conductive trace on the package substrate 16. The secondportion 114B can be disposed over molding material 22 of the RF module110. The second portion 114B can include patterned conductive materialover the molding material 22. The second portion 114B can be implementedby the same material as the shielding layer 32 of a shielding structureof the RF module 110. The second portion 114B can be formed during anoperation during which the shielding layer 32 is formed. The secondportion 114B of the antenna and the shielding layer 32 can beapproximately the same distance from the packaging substrate 16. One ormore wire bonds 116 can electrically connect the first portion 114A ofthe antenna with the second portion of the antenna 114B.

It can be desirable to reduce the physical size of an RF module with anintegrated antenna. Certain antenna designs can reduce the physical sizeand/or footprint of such an RF module having an integrated antenna. FIG.12 illustrates an RF module 120 with an integrated antenna 124 shieldedfrom an RF component. Any suitable principles and advantages of the RFmodule 120 can be implemented in combination with any of the otherembodiments discussed herein. With the antenna 124, the RF module 120can have a length that is reduced about 15% to 20% relative to someother antenna designs. Accordingly, the RF module 120 can have a smallerfootprint that such other antenna designs.

Although the RF modules shown in FIGS. 9A to 9E include wire bondsdisposed between an RF component and an integrated antenna, otherconductive structures can provide shielding between the RF component andthe integrated antenna in certain embodiments. For example, a conductiveconformal structure can provide such shielding. Accordingly, aconductive conformal structure can be disposed between an RF componentand an integrated antenna in an RF module in accordance with anysuitable principles and advantages discussed herein.

Any of the processes of forming a shielding layer over a radio frequencycomponent of a module and leaving an antenna unshielded discussed hereincan be modified to form such a conformal layer. For example, a throughmold via can be formed through molding material of a molding structureof an RF module. Laser scribing can remove the molding material to formsuch a through mold via. Then a conductive layer can be formed over theRF module by sputtering or any other suitable manner. This can form aconductive layer over the molding material and within the through moldvia, including along a sidewall of the through mold via. The conductivelayer can then be removed over the integrated antenna such that theantenna of the RF module is unshielded over the packaging substrate.Such removal can be performed in accordance with any suitable principlesand advantages discussed herein, such as laser removal of conductivematerial over the antenna and/or removing masking material over theantenna. After removing the conductive layer over the antenna, aconductive conformal structure can remain within the through mold via.This conductive conformal structure can be in contact with the shieldinglayer over the RF component and be included in the shielding structurearound the RF component. Accordingly, this conductive conformalstructure can provide shielding between the RF component and the antennaof the RF module.

FIG. 13A illustrates an RF module 130 with a through mold via 132. Thethrough mold via 132 can be formed by laser scribing, for example. Thethrough mold via 132 can have one or more sloped sidewalls. Asillustrated, the through mold via 132 is disposed between RF component12 and the antenna 14. The RF module 130 includes a conductive layer 134over molding material 22. The conductive layer 134 is also formed overthe sloped sidewalls of the through mold via 132. The sloped sidewallsof the through mold via 132 can enable a conductive conformal structurebetween the RF component 12 and the antenna 14 to be formed when theconductive layer is formed over the RF component 12. With slopedsidewalls, a conductive conformal structure can be formed with desirablestep coverage between the antenna 14 and RF component 12.

FIG. 13B illustrates an RF module 130′ after the conductive layer 134shown in FIG. 13A is removed over an antenna 14. In the RF module 130′,a shielding structure around the RF component 12 includes the shieldinglayer 32 and a conductive conformal structure 136 over a sidewall of thethrough mold via 132. The conductive conformal structure 136 is arrangedto provide shielding between the RF component 12 and the antenna 14.Other sides of the RF component 12 can also be shielded by a conductiveconformal structure. For instance, the RF component 12 of the RF module130′ can be surrounded by a conductive conformal structure.

FIGS. 14A and 14B are diagrams of a shielded RF component on a carrierwith a printed antenna according to an embodiment. FIG. 14A is a topview and FIG. 14B is a side view. As shown in FIGS. 14A and 14B, acarrier 140 can have an antenna 14 printed thereon. The carrier 140 canbe a package substrate, such as a laminate substrate. The carrier 140can have fewer layers compared to the package substrates 16 discussedabove. For example, in certain applications, the carrier 140 can includetwo layers and the package substrate 16 can include four layers. An RFcomponent 12 can be shielded by a shielding structure 142, which can bea conformal shielding structure as illustrated. A packaged component 144can be disposed on the carrier 140 laterally from the antenna 14.Accordingly, the antenna 14 can transmit and/or receive signals withoutthe shielding structure 142 interfering. The packaged component 144 canbe disposed on the carrier 140 such that a ground pad on the carrier 140is electrically connected to the conformal shielding structure. Thepackaged component 144 can include a system in a package with aconformal shielding structure. The packaged component 144 can includemolded system in a package with its own package substrate.

FIGS. 15A, 15B, and 15C are schematic block diagrams of front endsystems according to certain embodiments. An RF front end can includecircuits in a signal path between an antenna and a baseband system. SomeRF front ends can include circuits in signal paths between one or moreantennas and a mixer configured to module a signal to RF or todemodulate an RF signal. RF components discussed above can include afront end system or a portion of a front end system.

The front end systems of FIGS. 15A, 15B, and 15C can be implemented bypackaged modules. Some packaged modules that include a front end system,such as any of the illustrated front end systems, can be multi-chipmodules and/or include other circuitry. Packaged modules that include afront end system can be referred to as front end modules. Some front endmodules can include a front end integrated circuit and other components,such as a crystal and/or a system on a chip, within a common shieldingstructure. A front end module is an example of an RF module. Front endmodules can include relatively low cost laminate based front end modulesthat combine low noise amplifiers with power noise amplifiers and/or RFswitches in certain implementations. In the systems of FIGS. 15A, 15B,and 15C, an antenna is integrated with the RF front end in a front endmodule. The front end modules can be implemented in accordance with anyof the principles and advantages discussed herein. Front end circuitscan be disposed on a package substrate and surrounded by a shieldingstructure. An antenna can be on the package substrate outside of theshielding structure. A front end module with an integrated antenna canbe an antenna in a package system.

FIG. 15A is a schematic block diagram of an RF front end system 150according to an embodiment. The RF front end system 150 is configured toreceive RF signals from the antenna 14 and to transmit RF signals by wayof the antenna 14. The antenna 14 can be implemented in accordance withany of the principles and advantages discussed herein. The illustratedfront end system 150 includes a first multi-throw switch 152, a secondmulti-throw switch 153, a receive signal path that includes a low noiseamplifier (LNA) 154, a bypass signal path that includes a bypass network155, a transmit signal path that includes a power amplifier 156, and acontrol and biasing circuit 157. The low noise amplifier 154 can be anysuitable low noise amplifier. The bypass network 155 can include anysuitable network for matching and/or bypassing the receive signal pathand the transmit signal path. The bypass network 155 can be implementedby a passive impedance network and/or by a conductive trace or wire. Thepower amplifier 156 can be implemented by any suitable power amplifier.The LNA 154, the switches 152 and 153, and the power amplifier 156 canbe shielded from the antenna 14 by wire bonds of a shielding structurein accordance with any of the principles and advantages discussedherein. The shielding structure can include a shielding layer over theLNA 154, the switches 152 and 153, and the power amplifier 156. Theshielding layer can leave the antenna 14 unshielded. The shielding layercan be implemented in accordance with any of the principles andadvantages discussed herein.

The first multi-throw switch 152 can selectively electrically connect aparticular signal path to the antenna 14. The first multi-throw switch152 can electrically connect the receive signal path to the antenna 14in a first state, electrically connect the bypass signal path to theantenna 14 in a second state, and electrically connect the transmitsignal to the antenna 14 in a third state. The second multi-throw switch153 can selectively electrically connect a particular signal path to aninput/output port of the front end system 150, in which the particularsignal path is the same signal path electrically connected to theantenna 14 by way of the first multi-throw switch 152. Accordingly,second multi-throw switch 153 together with the first multi-throw switch152 can provide a signal path between the antenna 14 and an input/outputport of the front end system 150. A system on a chip (SOC) can beelectrically connected to the input/output port of the front end system150.

The control and biasing circuit 157 can provide any suitable biasing andcontrol signals to the other circuits of the front end system 150. Forexample, the control and biasing circuit 157 can provide bias signals tothe LNA 154 and/or the power amplifier 156. Alternatively oradditionally, the control and biasing circuit 157 can provide controlsignals to the multi-throw switches 152 and 153 to set the state ofthese switches.

FIG. 15B is a schematic block diagram of an RF front end system 150Aaccording to an embodiment. The RF front end system 150A of FIG. 15B issimilar to the RF front end system 150 of FIG. 15A, except that atransmit signal path is omitted and the multi-throw switches 152A and153A each have one fewer throw that the multi-throw switches 152 and153. The illustrated front end system 150A includes a receive signalpath and a bypass signal path and does not include a transmit signalpath.

FIG. 15C is a schematic block diagram of an RF front end system 150Baccording to an embodiment. The RF front end system 150B of FIG. 15C islike the RF front end system 150 of FIG. 15A, except that a poweramplifier of the transmit signal path is omitted from the RF front endsystem 150B. The RF front end system 150B includes input/output portsfor coupling to a respective throw of each of the multi-throw switches152 and 153. A power amplifier external to the front end system 150B canbe electrically connected between these input/output ports such that thepower amplifier is included in the transmit signal path between themulti-throw switches 152 and 153. The power amplifier can be includedwithin a common shielding structure as the elements of the RF front endsystem 150B illustrated in FIG. 15C and in a different die than theelements of the RF front end system 150B illustrated in FIG. 15C. Insome instances, the power amplifier can be implemented in a differentpackaged module than the elements of the RF front end system 150Billustrated in FIG. 15C.

FIGS. 16A and 16B are schematic block diagrams of illustrative wirelesscommunication devices that include partially shielded RF modules inaccordance with one or more embodiments. The wireless communicationdevice 160 can be any suitable wireless communication device. Forinstance, this device can be a mobile phone such as a smart phone. Asillustrated, the wireless communication device 160 includes a firstantenna 14, a wireless personal area network (WPAN) system 161, atransceiver 162, a processor 163, a memory 164, a power management block165, a second antenna 166, and an RF front end system 167. Any of the RFmodules discussed herein can include or be included in the WPAN system161. For instance, an RF module can include a shielding layer over someor all of the WPAN system 161 and the antenna 14 can be unshielded. TheWPAN system 161 is an RF front end system configured for processing RFsignals associated with personal area networks (PANs). The WPAN system161 can be configured to transmit and receive signals associated withone or more WPAN communication standards, such as signals associatedwith one or more of Bluetooth, ZigBee, Z-Wave, Wireless USB, INSTEON,IrDA, or Body Area Network. In another embodiment, a wirelesscommunication device can include a wireless local area network (WLAN)system in place of the illustrated WPAN system, and the WLAN system canprocess wireless local area network signals, such as Wi-Fi signals. TheRF front end system 167 can be implemented in accordance with any of theprinciples and advantages related to partially shielded modulesdiscussed herein in certain applications.

The illustrated wireless communication device 160A of FIG. 16B is adevice configured to communicate over a WPAN. This wirelesscommunication device 160A can be relatively less complex than thewireless communication device 160 of FIG. 16A. As illustrated, thewireless communication device 160A includes an antenna 14, a WPAN system161, a transceiver 162A, a processor 163, and a memory 164. The WPANsystem 161 can be implemented in accordance with any of the principlesand advantages related to partially shielded modules discussed herein.An RF module can include the WPAN system 161 on a package substrate andthe antenna 14 on the package substrate. In another embodiment, awireless communication device can include a wireless local area network(WLAN) system in place of the WPAN system 161 illustrated in FIG. 16B,and the WLAN system can process wireless local area network signals,such as Wi-Fi signals.

Some of the embodiments described above have provided examples inconnection with RF components, front end system and/or wirelesscommunications devices. However, the principles and advantages of theembodiments can be used for any other systems or apparatus that couldbenefit from any of the selective shielding techniques, shieldingstructures, integrated antennas, circuits, or any combination thereofdescribed herein. Although described in the context of RF circuits, oneor more features described herein can also be utilized in packagingapplications involving non-RF components. Similarly, one or morefeatures described herein can also be utilized in packaging applicationswithout electromagnetic isolation functionality. Moreover, whileembodiments discussed herein include an RF shielding structure and anantenna external to the shielding structure, other electronic componentscan be on a package substrate of a module and external to a RF shieldingstructure on the package substrate instead of or in addition to anantenna. The principles and advantages discussed herein can be appliedto two or more shielding structures around electronic components on apackaging substrate and an antenna on the packaging substrate that isexternal to each of the two or more shielding structures. Any of theprinciples and advantages of the embodiments discussed can be used inany other systems or apparatus that could benefit from any of theselective shielding features discussed herein.

The various features and processes described herein may be implementedindependently of one another, or may be combined in various ways. Allpossible combinations and sub combinations are intended to fall withinthe scope of this disclosure. In addition, certain method or processblocks may be omitted in some implementations. The methods and processesdisclosed herein are also not limited to any particular sequence, andthe blocks or states relating thereto can be performed in any othersequences that are appropriate. For example, described blocks or statesmay be performed in an order other than that specifically disclosed, ormultiple blocks or states may be combined in a single block or state.The example blocks or states may be performed in serial, in parallel, orin some other manner as appropriate. Blocks or states may be added to orremoved from the disclosed example embodiments as suitable. The examplesystems and components described herein may be configured differentlythan described. For example, elements may be added to, removed from, orrearranged compared to the disclosed example embodiments. Variousembodiments can apply different techniques for fabricating differenttypes of electronic devices.

Aspects of this disclosure can be implemented in various electronicdevices. Examples of the electronic devices can include, but are notlimited to, consumer electronic products, parts of the consumerelectronic products or other electronic products such as packagedmodules and/or system board assemblies, electronic test equipment,cellular communications infrastructure such as a base station, etc.Examples of the electronic devices can include, but are not limited to,a mobile phone such as a smart phone, a wearable computing device suchas a smart watch or an ear piece, an Internet of Things (IoT) device, atelephone, a television, a computer monitor, a computer, a modem, ahand-held computer, a laptop computer, a tablet computer, a personaldigital assistant (PDA), a microwave, a refrigerator, a vehicularelectronics system such as an automotive electronics system, a stereosystem, a DVD player, a CD player, a digital music player such as an MP3player, a radio, a camcorder, a camera such as a digital camera, aportable memory chip, a washer, a dryer, a washer/dryer, peripheraldevice, a clock, etc. Further, the electronic devices can includeunfinished products.

Unless the context clearly requires otherwise, throughout thedescription and the claims, the words “comprise,” “comprising,”“include,” “including,” and the like are generally to be construed in aninclusive sense, as opposed to an exclusive or exhaustive sense; that isto say, in the sense of “including, but not limited to.” The word“coupled,” as generally used herein, refers to two or more elements thatmay be either directly connected, or connected by way of one or moreintermediate elements. Likewise, the word “connected,” as generally usedherein, refers to two or more elements that may be either directlyconnected, or connected by way of one or more intermediate elements.Additionally, the words “herein,” “above,” “below,” and words of similarimport, when used in this application, shall refer to this applicationas a whole and not to any particular portions of this application. Wherethe context permits, words in the above Detailed Description of CertainEmbodiments using the singular or plural number may also include theplural or singular number, respectively. The word “or” in reference to alist of two or more items, that word covers all of the followinginterpretations of the word: any of the items in the list, all of theitems in the list, and any combination of the items in the list.

Moreover, conditional language used herein, such as, among others,“can,” “could,” “might,” “may,” “e.g.,” “for example,” “such as” and thelike, unless specifically stated otherwise, or otherwise understoodwithin the context as used, is generally intended to convey that certainembodiments include, while other embodiments do not include, certainfeatures, elements and/or states. Thus, such conditional language is notgenerally intended to imply that features, elements and/or states are inany way required for one or more embodiments or whether these features,elements and/or states are included or are to be performed in anyparticular embodiment.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the disclosure. Indeed, the novel apparatus, methods, andsystems described herein may be embodied in a variety of other forms;furthermore, various omissions, substitutions and changes in the form ofthe methods and systems described herein may be made without departingfrom the spirit of the disclosure. For example, while blocks arepresented in a given arrangement, alternative embodiments may performsimilar functionalities with different components and/or circuittopologies, and some blocks may be deleted, moved, added, subdivided,combined, and/or modified. Each of these blocks may be implemented in avariety of different ways. Any suitable combination of the elements andacts of the various embodiments described above can be combined toprovide further embodiments. The accompanying claims and theirequivalents are intended to cover such forms or modifications as wouldfall within the scope and spirit of the disclosure.

What is claimed is:
 1. A packaged radio frequency module comprising: apackage substrate; a radio frequency shielding structure extending abovethe package substrate, the radio frequency shielding structure includinga shielding layer substantially parallel to the package substrate; aradio frequency component over the package substrate and in an interiorof the radio frequency shielding structure, the radio frequencycomponent being disposed between the shielding layer and the packagesubstrate; a protective layer over the shielding layer, the shieldinglayer being disposed between the protective layer and the radiofrequency component; and an antenna on the package substrate external tothe radio frequency shielding structure, the radio frequency shieldingstructure configured to provide shielding between the antenna and theradio frequency component.
 2. The packaged radio frequency module ofclaim 1 wherein the radio frequency shielding structure includes wirebonds disposed between the antenna and the radio frequency component. 3.The packaged radio frequency module of claim 1 wherein the radiofrequency shielding structure includes wire bond walls disposed aroundat least two sides of the radio frequency component.
 4. The packagedradio frequency module of claim 1 wherein the shielding layer includescopper.
 5. The packaged radio frequency module of claim 1 wherein theprotective layer includes titanium.
 6. The packaged radio frequencymodule of claim 1 wherein the radio frequency component includes a frontend integrated circuit.
 7. The packaged radio frequency module of claim6 wherein the radio frequency component further includes a crystal. 8.The packaged radio frequency module of claim 6 wherein the front endintegrated circuit includes a semiconductor-on-insulator die thatincludes at least one of a low noise amplifier or a power amplifier. 9.The packaged radio frequency module of claim 1 wherein the radiofrequency component is attached to the package substrate and the antennais printed on the package substrate.
 10. A packaged radio frequencymodule comprising: a package substrate; a radio frequency shieldingstructure extending above the package substrate, the radio frequencyshielding structure including a wire bond wall disposed around a firstside of the radio frequency component and a conformal structure disposedaround a second side of the radio frequency component, the second sideopposing the first side; a radio frequency component over the packagesubstrate and in an interior of the radio frequency shielding structure;and an antenna on the package substrate external to the radio frequencyshielding structure, the radio frequency shielding structure configuredto provide shielding between the antenna and the radio frequencycomponent, and the wire bond wall extending farther above the packagesubstrate than the antenna.
 11. The packaged radio frequency module ofclaim 10 wherein the radio frequency shielding structure includes ashielding layer substantially parallel to the package substrate, and theradio frequency component is disposed between the shielding layer andthe package substrate.
 12. The packaged radio frequency module of claim11 further comprising a protective layer over the shielding layer, theshielding layer being disposed between the protective layer and theradio frequency component.
 13. A packaged radio frequency modulecomprising: a package substrate; a radio frequency shielding structureextending above the package substrate; a radio frequency component overthe package substrate and in an interior of the radio frequencyshielding structure; and an antenna on the package substrate external tothe radio frequency shielding structure, the radio frequency shieldingstructure configured to provide shielding between the antenna and theradio frequency component, and the radio frequency component including alow noise amplifier and a switch configured to selectively electricallyconnect the low noise amplifier to the antenna.
 14. The packaged radiofrequency module of claim 13 wherein the radio frequency shieldingstructure includes a shielding layer providing a shield over the radiofrequency component and leaving the packaged radio frequency moduleunshielded over the antenna.
 15. The packaged radio frequency module ofclaim 14 wherein the radio frequency shielding structure includes wirebonds in contact with the shielding layer.
 16. A system board assemblycomprising: a packaged component including a radio frequency componenton a package substrate, a radio frequency shielding structure around theradio frequency component, and an antenna on the package substrate andoutside of the radio frequency shielding structure; a system board onwhich the packaged component is disposed, the system board includingground pads electrically connected to the radio frequency shieldingstructure of the packaged component; and an electronic component on thesystem board, the shielding structure providing radio frequencyisolation between the radio frequency component and the electroniccomponent.
 17. The system board assembly of claim 16 wherein the radiofrequency shielding structure includes wire bonds disposed between theantenna and the radio frequency component.
 18. A front end modulecomprising: a radio frequency component on a package substrate, theradio frequency component including a low noise amplifier and a switch;an radio frequency shielding structure disposed around the radiofrequency component; and an antenna on the package substrate, theantenna being external to the radio frequency shielding structure, andthe switch being configured selectively electrically connect the lownoise amplifier with the antenna.
 19. The front end module of claim 18further comprising a bypass path, the switch configured to electricallyconnect the low noise amplifier and the antenna in a first state and toelectrically connect the bypass path and the antenna in a second state.20. The front end module of claim 19 further comprising a poweramplifier, the switch configured to electrically connect the poweramplifier and the antenna in a third state.
 21. The front end module ofclaim 20 wherein the low noise amplifier and the power amplifier circuitare embodied on a single semiconductor-on-insulator die.